John Lannon

General Manager, Micross Advanced Interconnect Technology

Dr. John Lannon (‘91 BS WVU/‘96 PhD WVU in Physics) is the General Manager of Micross Advanced Interconnect Technology. He has worked on the fabrication and improvement of resistive IR emitter devices (a MEMS-like device) for Infrared Scene Projectors for over 20 years. Since 2005, he has assisted with the development of high-density interconnects (sub-20 µm pitch) for die stacking and detector hybridization and the development of wafer-level vacuum packaging (WLVP) of MEMS devices. As part of Micross, he continues to be focused on the development and implementation of 3D integration and advanced packaging technologies (flip-chip bumping, high density interconnect bonding, WLVP, through-Si vias (TSV), through glass via (TGV), Si interposers, etc.) for government and commercial applications, as well as the development of novel 3D microstructures. John is an active member of the WLP Symposium (formerly IWLPC) planning committee, serving as 3D Integration and Packaging Track Chair in 2020 and 2022.