WEBINAR DETAILS
  • About
    The performance of modern edge processing solutions is becoming limited by traditional design methodologies. Join Micron and Mercury Systems as they discuss the technologies and processes required to deliver leading performance at chip scale. Leveraging cross-industry partnerships, integration at chip scale with leading edge memory & Storage results in advanced packaged solutions that offer unparalleled space savings, processing capability, and more.

    Sponsored by:
  • Price
    Free
  • Language
    English
  • OPEN TO
    Everyone
  • Dial-in available
    (listen only)
    Not available.
FEATURED PRESENTERS
  • Webinar hosting presenter

    Todd Legler

    Sr. System Architect, Micron - Embedded Business Unit
    Todd Legler has more than 25 years working with semiconductor memories. He is currently working as a Sr. System Architect supporting Industrial Multi-Market customers and driving Aerospace and Defense strategies for Micron’s Embedded Business...
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  • Webinar hosting presenter

    Jennifer Keenan

    Sr. Prin. Product Manager, Mercury Systems Microelectronics Advanced Packaging group
    Jennifer Keenan is the Sr. Prin. Product Manager for the Microelectronics Advanced Packaging group of Mercury Systems in Phoenix, Arizona. As part of the Microsystems team, Jennifer is driving the heterogenous integrated system-in-package roadmap...
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  • Webinar hosting presenter John M

    John McHale

    EVP & Group Editorial Director, Military Embedded Systems
    John is Executive Vice President & Group Editorial Director of Military Embedded Systems, SOSA Special Edition, and VITA Technologies. He has covered the aerospace and defense electronics industry for more than 25 years. During that time John has...
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